PolyMide™ CoPA

Features Polymaker's Warp-Free™ technology

PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing. PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.

Excellent Toughness - The outstanding mechanical strength and toughness makes PolyMide™ CoPA an excellent choice for engineering based applications.

Excellent heat resistance - With a high softening temperature of ~180 °C, PolyMide™ CoPA is one of the most heat resistant 3D printing materials in the market.

Improved printability – Unlike many Nylon filaments, PolyMide™ CoPA is extremely easy to work with exhibiting excellent dimensional stability. It is compatible with most filament-based 3D printers with no heated bed or chamber required!

Uncompromised Quality - Polymakers leading quality control process and rigorous in-house testing, and rigorous in-house ensure reliable printing and consistency across spools and batches.

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Technologies

PolyMide™ CoPA features Polymaker's Warp-Free™ technology:

Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.